Mushkin Announces New Heatsink Design for High Performance
Mushkin announces a new heatsink for high performance
DRAM memory modules. The new heatsink is designed to handle the increased thermal
demands of today's high performance PCs.
The new design delivers superior
thermal conductivity and dissipation. It's sleek and aero-efficient design
provides 58% more surface area than Mushkin's previous heatsink.
"By opening up the design we improved airflow in and around the
memory module and increased the surface area," says Brian Flood, head of
Mushkin's product development.
"It's far superior in performance and
Additionally, the new design utilizes an advanced
thermal adhesive with double the thermal conductivity of the previous material.
Mushkin is using the new heatsink on all its performance DDR and DDR2 products,
such as the Redline series products that benefit the most from the new design,
like the popular Redline and Xtreme series products.
Expect to see the new heatsink on all Mushkin performance DDR
Mushkin, Inc., based in Denver, Colorado has been
operating its enhanced memory and components e-commerce site since 1994. It was
one of the first "boutique" computer e-stores on the web. Mushkin offers the
fastest and most reliable memory available to consumers today. For more
information about Mushkin and its enhanced memory products, contact:
Communications Department, Mushkin, Inc., 333 West Colfax Avenue Suite 400,
Denver, Colorado, USA, 80204. Telephone is 800-569-1868; FAX is 303-534-0827.
Visit Mushkin at http://www.mushkin.com.