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Mushkin Announces New Heatsink Design
Date: Friday July 29, 2005
Category: Memory
Manufacturer Link: Mushkin
The new design utilizes an advanced thermal adhesive with double the thermal conductivity of the previous material.
 

Mushkin Announces New Heatsink Design for High Performance PC's

Mushkin announces a new heatsink for high performance DRAM memory modules. The new heatsink is designed to handle the increased thermal demands of today's high performance PCs.

The new design delivers superior thermal conductivity and dissipation. It's sleek and aero-efficient design provides 58% more surface area than Mushkin's previous heatsink.

"By opening up the design we improved airflow in and around the memory module and increased the surface area," says Brian Flood, head of Mushkin's product development.

"It's far superior in performance and appearance."

Additionally, the new design utilizes an advanced thermal adhesive with double the thermal conductivity of the previous material. Mushkin is using the new heatsink on all its performance DDR and DDR2 products, such as the Redline series products that benefit the most from the new design, like the popular Redline and Xtreme series products. Expect to see the new heatsink on all Mushkin performance DDR products.

Mushkin, Inc., based in Denver, Colorado has been operating its enhanced memory and components e-commerce site since 1994. It was one of the first "boutique" computer e-stores on the web. Mushkin offers the fastest and most reliable memory available to consumers today. For more information about Mushkin and its enhanced memory products, contact: Communications Department, Mushkin, Inc., 333 West Colfax Avenue Suite 400, Denver, Colorado, USA, 80204. Telephone is 800-569-1868; FAX is 303-534-0827. Visit Mushkin at http://www.mushkin.com.

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   11 / 15 / 2019 | 12:57AM
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